


3M Scotchcast 8N 電氣絕緣雙組分環氧樹脂為填充性樹脂,該產品的特點是半柔軟、低放熱、機械***性以及優越的耐熱沖擊性能。該樹脂非常容易使用,具有***的操作性,易于混配。該型號樹脂具有良好的使用有效期,且粘度中等。重量混合比為1:1,可以室溫固化,為獲得性能,建議適當延長固化時間。
該樹脂基本沒有任何毒性,經常被用于需要優良的耐熱沖擊及機械沖擊性能的場合,該樹脂粘性較高,應力低且固化時具有低放熱性,用于溫度敏感元件的灌注中時可以降低應力及溫度對元器件的影響。
.低放熱性
.良好的可操作性
.優良的機械性能及耐熱沖擊性
3M Scotchcast
Electrical Resin 8N
Two-Part, Room-Curing, Semiflexible,
Unfilled, Epoxy Liquid Resin
Data Sheet September 2016
Description
3M Scotchcast Electrical Resin 8N is a low-stress, highly moisture-resistant
compound that cures at room temperature. This epoxy resin system offers long pot life,
low viscosity, a 1:1 mix ratio (by weight), Class B (130?C) temperature rating, and is
commonly used to coat printed circuit boards, pot connectors, and impregnate
electrical and electronic components. Because of its low exotherm, Scotchcast resin 8
is also frequently specified for impregnating and encapsulating temperature sensitive
units.
? Low exotherm
? High moisture resistance
? Highly resistant to mechanical and thermal shock
? Extended pot life
Handling Properties
Mix Ratio (A-B) Wt 1:1
Vol (%) 46:54
Viscosity
@ 23°C (73°F)
A = 12,500 cps
B = 4,000 cps
Mixed = 7,000 cps
Density A = 1.16 kg/l (9.71 lbs/gal)
B = 0.995 kg/l (8.30 lbs/gal)
Flash Point A = 204°C (400°F)
B =201°C (395°F)
Gel Time 30 min. @ 60°C (140°F)
Curing Guide 23°C (73°F) 24-48 hrs
60°C (140°F) 2 hrs
95°C (203°F) 1 hr

3M Scotchcast 8N 電氣絕緣雙組分環氧樹脂為填充性樹脂,該產品的特點是半柔軟、低放熱、機械***性以及優越的耐熱沖擊性能。該樹脂非常容易使用,具有***的操作性,易于混配。該型號樹脂具有良好的使用有效期,且粘度中等。重量混合比為1:1,可以室溫固化,為獲得性能,建議適當延長固化時間。
該樹脂基本沒有任何毒性,經常被用于需要優良的耐熱沖擊及機械沖擊性能的場合,該樹脂粘性較高,應力低且固化時具有低放熱性,用于溫度敏感元件的灌注中時可以降低應力及溫度對元器件的影響。
.低放熱性
.良好的可操作性
.優良的機械性能及耐熱沖擊性
3M Scotchcast
Electrical Resin 8N
Two-Part, Room-Curing, Semiflexible,
Unfilled, Epoxy Liquid Resin
Data Sheet September 2016
Description
3M Scotchcast Electrical Resin 8N is a low-stress, highly moisture-resistant
compound that cures at room temperature. This epoxy resin system offers long pot life,
low viscosity, a 1:1 mix ratio (by weight), Class B (130?C) temperature rating, and is
commonly used to coat printed circuit boards, pot connectors, and impregnate
electrical and electronic components. Because of its low exotherm, Scotchcast resin 8
is also frequently specified for impregnating and encapsulating temperature sensitive
units.
? Low exotherm
? High moisture resistance
? Highly resistant to mechanical and thermal shock
? Extended pot life
Handling Properties
Mix Ratio (A-B) Wt 1:1
Vol (%) 46:54
Viscosity
@ 23°C (73°F)
A = 12,500 cps
B = 4,000 cps
Mixed = 7,000 cps
Density A = 1.16 kg/l (9.71 lbs/gal)
B = 0.995 kg/l (8.30 lbs/gal)
Flash Point A = 204°C (400°F)
B =201°C (395°F)
Gel Time 30 min. @ 60°C (140°F)
Curing Guide 23°C (73°F) 24-48 hrs
60°C (140°F) 2 hrs
95°C (203°F) 1 hr

